CHR2391

Ref. : : DSCHR23915263 - 20 Sep 05

5/6

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Chip Assembly and Mechanical Data

Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended

Bonding pad positions

Chip thickness : 100µm

To Vg(multiplier) DC Gate supply

To Vg(Buffer) DC Gate supply

To

VdL(lna) +VdM(x2+buffer)

DC Gate supply

To Vg (mixer) DC Gate supply

To Vg (lna) DC Gate supply

Unit : µm

Tol : + / - 35µm