B32671L datasheet(32/39 Pages) EPCOS

32 / 39 page

Body temperature should follow the description below:

MKP capacitor

During pre-heating: Tp

≤110 °C

During soldering: Ts

≤120 °C, t

≤45 s

MKT capacitor

During pre-heating: Tp

≤125 °C

During soldering: Ts

≤160 °C, t

≤45 s

When SMD components are used together with leaded ones, the film capacitors should not pass

into the SMD adhesive curing oven. The leaded components should be assembled after the SMD

curing step.

Leaded film capacitors are not suitable for reflow soldering.

In order to ensure proper conditions for manual or selective soldering, the body temperature of

the capacitor (Ts) must be

≤120 °C.

One recommended condition for manual soldering is that the tip of the soldering iron should

be <360

°C and the soldering contact time should be no longer than 3 seconds.

For uncoated MKT capacitors with lead spacings

≤10 mm (B32560/B32561) the following mea-

sures are recommended:

pre-heating to not more than 110

°C in the preheater phase

rapid cooling after soldering

Please refer to our Film Capacitors Data Book in case more details are needed.

B32671L, B32672L

High V AC, high temperature (wound)

Page 32 of 39

Please read Cautions and warnings and

Important notes at the end of this document.

B32671L bảng dữ liệu(PDF) 32 Page - EPCOS