Data Sheet

ADP197

Rev. C | Page 13 of 13

OUTLINE DIMENSIONS

A

B

C

0.675

0.595

0.515

0.380

0.355

0.330

0.270

0.240

0.210

1.000

0.950

0.900

1.500

1.450

1.400

1

2

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.345

0.295

0.245

1.00

REF

0.50

BSC

BALL A1

IDENTIFIER

SEATING

PLANE

0.50 BSC

COPLANARITY

0.075

Figure 34. 6-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-6-2)

Dimensions shown in millimeters

1.70

1.60

1.50

0.425

0.350

0.275

TOP VIEW

6

1

4

3

0.35

0.30

0.25

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.60

0.55

0.50

1.10

1.00

0.90

0.20 REF

0.05 MAX

0.02 NOM

0.65 BSC

EXPOSED

PAD

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.15 REF

2.10

2.00 SQ

1.90

0.20 MIN

Figure 35. 6-Lead Lead Frame Chip Scale Package [LFCSP_UD]

2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead

(CP-6-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature

Range

Package Description

Package

Option

Branding

On/Off

Time (μs)

ADP197ACBZ-R7

−40°C to +85°C

6-Ball Wafer Level Chip Scale Package [WLCSP]

CB-6-2

87

300

ADP197ACBZ-01-R7

−40°C to +85°C

6-Ball Wafer Level Chip Scale Package [WLCSP]

CB-6-2

AP

20

ADP197ACPZN-01-R7

−40°C to +85°C

6-Lead Lead Frame Chip Scale Package [LFCSP_UD]

CP-6-3

AP

20

ADP197ACPZN-02-R7

−40°C to +85°C

6-Lead Lead Frame Chip Scale Package [LFCSP_UD]

CP-6-3

D8

20

ADP197CB-EVALZ

Evaluation Board

ADP197CP-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

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registered trademarks are the property of their respective owners.

D09298-0-10/14(C)