Data Sheet

ADG5421/ADG5423

OUTLINE DIMENSIONS

Figure 34. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-10-9)

Dimensions shown in millimeters

Figure 35. 10-Lead Mini Small Outline Package [MSOP]

(RM-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

ADG5421BCPZ-RL7

−40°C to +125°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

BN

ADG5421BRMZ

−40°C to +125°C

10-Lead Mini Small Outline Package [MSOP]

RM-10

S47

ADG5421BRMZ-RL7

−40°C to +125°C

10-Lead Mini Small Outline Package [MSOP]

RM-10

S47

ADG5423BCPZ-RL7

−40°C to +125°C

10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

BM

ADG5423BRMZ

−40°C to +125°C

10-Lead Mini Small Outline Package [MSOP]

RM-10

S3D

ADG5423BRMZ-RL7

−40°C to +125°C

10-Lead Mini Small Outline Package [MSOP]

RM-10

S3D

1

Z = RoHS Compliant Part.

2.48

2.38

2.23

0.50

0.40

0.30

10

1

6

5

0.30

0.25

0.20

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.74

1.64

1.49

0.20 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

TOP VIEW

BOTTOM VIEW

0.20 MIN

COMPLIANT TO JEDEC STANDARDS MO-187-BA

6°

0°

0.70

0.55

0.40

5

10

1

6

0.50 BSC

0.30

0.15

1.10 MAX

3.10

3.00

2.90

COPLANARITY

0.10

0.23

0.13

3.10

3.00

2.90

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

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D11369-0-1/15(A)

Rev. A | Page 17 of 17