Data Sheet

AD8231-EP

Rev. A | Page 7 of 20

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

6 V

Output Short-Circuit Current

Indefinite1

Input Voltage (Common-Mode)

−VS − 0.3 V to +VS + 0.3 V

Differential Input Voltage

−VS − 0.3 V to +VS + 0.3 V

Storage Temperature Range

–65°C to +150°C

Operational Temperature Range

–55°C to +125°C

Package Glass Transition Temperature

130°C

ESD (Human Body Model)

1.5 kV

ESD (Charged Device Model)

1.5 kV

ESD (Machine Model)

0.2 kV

1

For junction temperatures between 105°C and 130°C, short-circuit operation

beyond 1000 hours can impact part reliability.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Table 5.

Thermal Pad

θJA

Unit

Soldered to Board

54

°C/W

Not Soldered to Board

96

°C/W

The θJA values in Table 5 assume a 4-layer JEDEC standard

board. If the thermal pad is soldered to the board, it is

also assumed it is connected to a plane. θJC at the exposed pad

is 6.3°C/W.

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8231-EP is

limited by the associated rise in junction temperature (TJ) on

the die. At approximately 130°C, which is the glass transition

temperature, the plastic changes its properties. Even

temporarily exceeding this temperature limit may change the

stresses that the package exerts on the die, permanently shifting

the parametric performance of the amplifiers. Exceeding a

temperature of 130°C for an extended period can result in a loss

of functionality.

ESD CAUTION