AD633-EP

Enhanced Product

Rev. B | Page 4 of 7

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

±18 V

Internal Power Dissipation

See Figure 2

Input Voltages1

±18 V

Output Short-Circuit Duration

Indefinite

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−55°C to +125°C

Junction Temperature

150°C

Lead Temperature (Soldering, 60 sec)

260°C

ESD Rating

1000 V

1

For supply voltages less than ±18 V, the absolute maximum input voltage is

equal to the supply voltage.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 3.

Package Type

θJA1

θJC2

Unit

R-8

123.9

42.8

°C/W

1

Test Condition 1: Thermal impedance simulated values are based on JEDEC

2S2P thermal test board. See JEDEC JESD51.

2

Test Condition 2: Thermal impedance simulate values are based on JEDEC

1S0P thermal test board. See JEDEC JESD51.

POWER DERATING CURVE

Figure 2 shows the maximum power dissipation vs. the ambient

temperature.

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

AMBIENT TEMPERATURE (°C)

Figure 2. Maximum Power Dissipation vs. Ambient Temperature (TA)

ESD CAUTION