74FCT38074S Datasheet

6

© 2015-2025 Renesas Electronics Corporation

Jun 12, 2025

Test Load and Circuit

Thermal Characteristics

8SOIC

8DFN

Marking Diagrams

Notes:

1. “

**” is the lot number.

2. “YYWW” or “YW” are the last digits of the year and week that the part was assembled.

3 “G” denotes RoHS compliant package.

4. “$” denotes mark code.

5. “I” denotes extended temperature range device.

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Unit

Thermal Resistance Junction to Ambient

JA

Still air

150



C/W

JA

1 m/s air flow

140



C/W

JA

3 m/s air flow

120



C/W

Thermal Resistance Junction to Case

JC

40



C/W

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Unit

Thermal Resistance Junction to Ambient

JA

Still air

140.7



C/W

JA

1 m/s air flow

136.5



C/W

JA

2 m/s air flow

133.3



C/W

JA

3 m/s air flow

131.4



C/W

Thermal Resistance Junction to Board

JB

93.8



C/W

Thermal Resistance Junction to Case

JC

64.5



C/W

Rs=33ohm

5 inches

CL = 5pF

50ohms

074S

YW**

8-pin DFN

IDT74FC

T38074S

DCGI

YYWW$

8-pin SOIC