LISY300AL datasheet(11/13 Pages) STMICROELECTRONICS

11 / 13 page

LISY300AL

Package information

11/13

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK® is an ST trademark.

ECOPACK® specifications are available at: www.st.com.

Figure 4.

LGA-28: mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.600

0.0630

1.300

0.0512

0.170

0.200

0.230 0.0067 0.0079 0.0091

6.900

7.000

7.100 0.2717 0.2756 0.2795

6.900

7.000

7.100 0.2717 0.2756 0.2795

0.350

0.0138

0.800

0.0315

0.450

0.0177

0.100

0.0039

0.800

0.0315

1.600

0.0630

4.800

0.1890

2.400

0.0945

0.050

0.0020

LGA28 (7x7x1.5mm)

Land Grid Array Package

8003444 A

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.600

0.0630

1.300

0.0512

0.170

0.200

0.230 0.0067 0.0079 0.0091

6.900

7.000

7.100 0.2717 0.2756 0.2795

6.900

7.000

7.100 0.2717 0.2756 0.2795

0.350

0.0138

0.800

0.0315

0.450

0.0177

0.100

0.0039

0.800

0.0315

1.600

0.0630

4.800

0.1890

2.400

0.0945

0.050

0.0020

LGA28 (7x7x1.5mm)

Land Grid Array Package

8003444 A

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