STPS3L40 datasheet(4/8 Pages) STMICROELECTRONICS

4 / 8 page

Characteristics

STPS3L40

4/8

Figure 9.

Relative variation of thermal

impedance junction to lead

versus pulse duration - SMB flat

Figure 10.

Reverse leakage current versus

reverse voltage applied (typical

values)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Z/R

th(j-l)

SMB flat

t (s)

Single pulse

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

I (mA)

V (V)

T =125°C

T =100°C

T =25°C

Figure 11.

Junction capacitance versus

reverse voltage applied (typical

values)

Figure 12.

Forward voltage drop versus

forward current

Figure 13.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

board FR4, eCU=35µm)

100

1000

100

C(pF)

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

100

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

(A)

(V)

T =25°C

(maximum values)

T =125°C

(maximum values)

T =125°C

(typical values)

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(cm²)

SMB flat

SMC

(°C/W)

th(j-a)

FIG 15A - WITHOUT EXPOSED PAD

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