LP4054

Aug.-2017

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www.lowpowersemi.com

Page 3 of 7

Preliminary Datasheet

LP4054

Function Block Diagram

1

5

2

3

4

TA

125℃

TDIE

CA

MA

VA

C1

C2

C3

REF

1.22V

CHRG

SHDN

TO BAT

2.9V

VCC

3μA

R3

1V

R4

0.1V

R5

ISET

GND

R2

R1

BAT

VIN

5μA

1000X

1X

+

+

+

+

+

+

-

-

-

-

-

-

Absolute Maximum Ratings

Note1



Input to GND(VIN) --------------------------------------------------------------------------------------------- -0.3V to 8V



Other Pin to GND ---------------------------------------------------------------------------------------------- -0.3V to 6V



BAT Short-circuit Duration ------------------------------------------------------------------------------------ Continuous



Maximum Junction Temperature ----------------------------------------------------------------------------------- 125℃



Operating Junction Temperature Range (TJ) ----------------------------------------------------------- -20℃ to 85℃



Maximum Soldering Temperature (at leads, 10 sec) ---------------------------------------------------------- 260℃

Note1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Information



Maximum Power Dissipation (SOT23-5, PD, TA=25°C) ------------------------------------------------------- 0.45W



Thermal Resistance (SOT23-5, JA) --------------------------------------------------------------------------- 250℃/W