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TDA7575BPD bảng dữ liệu(PDF) 29 Page - STMicroelectronics

tên linh kiện TDA7575BPD
Giải thích chi tiết về linh kiện  2 x 75W multifunction dual-bridge power amplifier with integrated digital diagnostics
PDF  32 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TDA7575BPD bảng dữ liệu(HTML) 29 Page - STMicroelectronics

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TDA7575B
Package information
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Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 39.
PowerSO36 (slug up) mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
M.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
3.25
3.43
0.128
0.135
A2
3.1
3.2
0.122
0.126
A4
0.8
1
0.031
0.039
A5
0.2
0.008
a1
0.030
-0.040
0.0011
-0.0015
b
0.22
0.38
0.008
0.015
c
0.23
0.32
0.009
0.012
D
15.8
16
0.622
0.630
D1
9.4
9.8
0.37
0.38
D2
1
0.039
E
13.9
14.5
0.547
0.57
E1
10.9
11.1
0.429
0.437
E2
2.9
0.114
E3
5.8
6.2
0.228
0.244
E4
2.9
3.2
0.114
1.259
e0.65
0.026
e3
11.05
0.435
G
0
0.075
0
0.003
H
15.5
15.9
0.61
0.625
h
1.1
0.043
L
0.8
1.1
0.031
0.043
N
10˚
10˚
s8 ˚8˚
(1) “D and E1” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15mm (0.006”)
(2) No intrusion allowed inwards the leads.
DI
PowerSO36 (SLUG UP)
7183931 D



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