R5F1214AMSP datasheet(3/85 Pages) RENESAS

3 / 85 page

RL78/G16

1. OUTLINE

R01DS0431EJ0130

Rev.1.30

Page 3 of 85

May 19, 2025

1.2

List of Part Numbers

Figure 1-1. Part Number, Memory Size, and Package of RL78/G16

Part No.　R 5 F 1 2 1 6 C M x x x S P #50

Packaging specifications

#00, #20, #60: Tray (HWQFN)

#10, #70: Tray (LSSOP (10-pin), SSOP, LQFP)

#30: Tray (LSSOP (10-pin), SSOP, LQFP)

Tube (LSSOP (20-pin))

Note 1

#40: Embossed Tape (HWQFN)

#50: Embossed Tape (LSSOP, SSOP, LQFP)

#5F: Embossed Tape (TSSOP)

#9F: Tube (TSSOP)

ROM number (omitted for blank products)

Package type

FP:

32-pin, LQFP, 0.8-mm pitch

SP: 10-pin, LSSOP, 0.65-mm pitch

16-pin, SSOP, 0.65-mm pitch

20-pin, LSSOP, 0.65-mm pitch

NA: 16-pin, HWQFN, 0.5-mm pitch

24-pin, HWQFN, 0.5-mm pitch

32-pin, HWQFN, 0.5-mm pitch

SM: 20-pin, TSSOP, 0.65mm pitch

Fields of application

A: Consumer applications, TA = –40°C to +85°C

G: Industrial applications, TA = –40°C to +105°C

M: Industrial applications, TA = –40°C to +125°C

ROM capacity

A: 16 KB

C: 32 KB

Pin count

1: 10-pin

4: 16-pin

6: 20-pin

7: 24-pin

B: 32-pin

RL78/G16 group: 121

Memory type

F: Flash memory

Renesas MCU

Renesas semiconductor product

Note 1.

The packaging specification of the 20-pin LSSOP products is Tube.

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