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14

LDD P SERIES LASER DIODE DRIVER

WIRING INSTRUCTIONS: LDD EVALUATION BOARD

The LDD P is designed to be soldered to a circuit board. The LDDEVALP evaluation board integrates with any LDD P laser

diode driver to speed up prototyping.

Figure 16 shows a top view of all of the components on the LDDEVALP. The remaining pages of this section elaborate

on each component labeled.

Table 4 gives a summary of the individual components, along with the page the detailed

component description can be found.

3

6

4

5

2

1

7

8

1P/3P

2P

}

5

1

2

3

4a

6

8

9

10

4b

4c

4d

7

}

TOP VIEW

11

Figure 16. LDDEVALP Component Diagram.

For more detail, refer to sections on following pages.

NUMBER

COMPONENT

FUNCTION

PAGE

1

LDD Module

Laser Diode Driver Component location

page 16

2

Enable/Disable wire pads

Enable/Disable laser current

page 16

3

Jumpers

Select LDD P model

page 16

4a

Decoupling Resistor

Decouple power supply

page 16

4b

Decoupling Capacitor

Decouple power supply

page 16

4c

Transzorb

Over-voltage protection

page 16

4d

Dominant Impedance

Laser diode over-current and transient protection

page 16

5

LED and bias resistor

Power ON indicator

page 17

6

Measurement wire pads

Measure laser diode current

page 17

7

MOD INPUT wire pads

Connections to optional signal generator

page 17

8

Laser diode wire pads

Solder laser diode cable to these pads

page 17

9

External photodiode wire pads

Monitor photodiode current while in constant current mode

page 17

10

Op-amp, four resistors, one capacitor

For operating LDD 2P in constant current mode

page 18

11

Power supply wire pads

Connections to power supply

page 18

Table 4. Typical Component Functions