CERACOLD / CECD

NEW

NEW

1

Features

Porous ceramic-based heat sink for

excellentinsulation

（Unit：ｍｍ）

L1

20

20

40

L2

20

20

40

Part Number

CECD-1.5-020020T

CECD-3.0-020020T

CECD-3.0-040040T

Thickness:t

1.5

3.0

3.0

Comparison of Heat Sink Efficiency

CECD

(t 3mm)

90℃

Aluminum plate

(t 3mm)

100

50

0

No heat sink

〈Test conditions〉

Heat source : □10mm(1.6W)

Specimen dimensions: □20mm(t3mm)

74℃

68℃

90℃

Stray capacitance occurs between the IC chip

(noise source) and the heat sink (not grounded),

which becomes an antenna and emits radiated noise.

Metal heat sink

Metal

Since ceramic is an insulator, it is not affected

by electrostatic coupling and does not act as an

antenna to radiate noise.

CERACOLD

IC

Ceramic

Heat conductive characteristics

Heat source

Power source

Specimen

Thermocouple

PCB

L2

Ceramic

Two-sides adhesive Tape

IC

Heat dissipation efficiency

EMI noise issues with metal heat sink

Standard

　

ー

JIS Z 8807

ー

ＣＥＣＤ

11.5

Ｇｒｅｅｎ

1.95

≧108

-40～125

Test type

Color

SpecificGravity

VolumeResistivity

Operatingtemp

Unit

W/m・K

ー

ー

Ω・cm

℃

JIS R 2616

（Hot-wire method）

（The values below are not guaranteed.）

JISK6911

compliant

Thermal

Conductivity

Have better thermal emissivity and heat dissipation is enhanced by a larger

surface area of porous ceramic material compared to aluminum material.

Lighter than aluminum heat sinks by approx.. 30%

No electromagnetic radiation emitted from the heat sink unlike metal heat sinks.

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© 2019 Kitagawa GmbH