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CLVC2G125IDCTRQ1 bảng dữ liệu(PDF) 1 Page - Texas Instruments |
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CLVC2G125IDCTRQ1 bảng dữ liệu(HTML) 1 Page - Texas Instruments |
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1 / 8 page ![]() 1 FEATURES DCT OR DCU PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 1OE 1A 2Y GND VCC 2OE 1Y 2A DESCRIPTION/ORDERING INFORMATION SN74LVC2G125-Q1 DUAL BUS BUFFER GATE WITH 3-STATE OUTPUTS SCES559B – MARCH 2004 – REVISED OCTOBER 2007 www.ti.com • Qualified for Automotive Applications • ESD Protection Exceeds JESD 22 • Supports 5-V V CC Operation – 2000-V Human-Body Model (A114-A) • Inputs Accept Voltages to 5.5 V – 200-V Machine Model (A115-A) • Max t pd of 4.3 ns at 3.3 V – 1000-V Charged-Device Model (C101) • Low Power Consumption, 10-μA Max I CC • ±24-mA Output Drive at 3.3 V • Typical V OLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • Typical V OHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C • I off Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II The SN74LVC2G125-Q1 is a dual bus buffer gate designed for 1.65-V to 5.5-V VCC operation. This device features dual line drivers with 3-state outputs. The outputs are disabled when the associated output-enable (OE) input is high. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION(1) TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) SSOP – DCT Tape and reel CLVC2G125IDCTRQ1 C25_ _ _ –40 °C to 85°C VSSOP – DCU Tape and reel CLVC2G125IDCURQ1(4) C25_ (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. (4) Product preview FUNCTION TABLE (EACH BUFFER) INPUTS OUTPUT Y OE A L H H L L L H X Z 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains Copyright © 2004–2007, Texas Instruments Incorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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