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M93C66-RBN3G bảng dữ liệu(PDF) 31 Page - STMicroelectronics

tên linh kiện M93C66-RBN3G
Giải thích chi tiết về linh kiện  16 Kbit, 8 Kbit, 4 Kbit, 2 Kbit and 1 Kbit (8-bit or 16-bit wide) MICROWIRE® serial access EEPROM
PDF  37 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M93C66-RBN3G bảng dữ liệu(HTML) 31 Page - STMicroelectronics

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M93C86, M93C76, M93C66, M93C56, M93C46
Package mechanical data
31/37
Figure 14.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline
1.
Drawing is not to scale.
2.
The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
3.
The circle in the top view of the package indicates the position of pin 1.
Table 26.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2x3 mm, data
Symbol
millimeters
inches(1)
1.
Values in inches are converted from mm and rounded to 4 decimal digits.
Typ
Min
Max
Typ
Min
Max
A
0.55
0.45
0.6
0.0217
0.0177
0.0236
A1
0.02
0
0.05
0.0008
0
0.002
b
0.25
0.2
0.3
0.0098
0.0079
0.0118
D
2
1.9
2.1
0.0787
0.0748
0.0827
D2
1.6
1.5
1.7
0.063
0.0591
0.0669
E
3
2.9
3.1
0.1181
0.1142
0.122
E2
0.2
0.1
0.3
0.0079
0.0039
0.0118
e
0.5
-
-
0.0197
-
-
L
0.45
0.4
0.5
0.0177
0.0157
0.0197
L1
0.15
0.0059
L3
0.3
0.0118
ddd(2)
2.
Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.08
0.08
D
E
UFDFPN-01
A
A1
ddd
L1
e
b
D2
L
E2
L3



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