DIA1412

Version 1.0, Jul 2024

www.dioo.com

© 2024 DIOO MICROCIRCUITS CO., LTD.

3

5. Thermal Considerations

The thermal resistance determines the heat insulation property of a material. The higher the thermal

resistance is, the lower the heat loss. Accumulation of heat energy degrades the performance of

semiconductor components.

Symbol

Metric

Value

Unit

MSOP-8

DFN-8

RθJA

Junction-to-ambient thermal resistance

204

173

°C/W

6. Electrical Characteristics

VDD = 3.0 V to 3.6 V, TA = -40°C to 125°C, all typical values at TA = 25°C, unless otherwise noted.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Power

VDD

Supply voltage

3.0

3.3

3.6

V

IDD

Supply current

1 conv./sec,

dynamic averaging disabled

270

µA

4 conv./sec,

dynamic averaging enabled

600

16 conv./sec,

dynamic averaging enabled

710

IDD

Standby supply current

Device in standby mode, no

SMBus communications,

______

ALERT

and

______

THERM/ADDR pins are not

asserted.

120

µA

Internal temperature monitor

Temperature inaccuracy

20°C < TA < 110°C

±0.5

±1

°C

-40°C < TA < 125°C

±1

±2

Temperature resolution

0.0625

°C

External temperature monitor

Temperature inaccuracy

20°C < TEXT < 110°C

TA = 25°C

±0.5

±1

°C

-40°C < TEXT < 125°C

TA = 25°C

±1

±2

Temperature resolution

0.0625

°C

Filter capacitor between DP and DN

CFILTER

Capacitive filter

Connected across external BJT

2.2

2.7

nF

Conversion time

tCONV

Conversion time of

all channels

Default settings, DIA1412

86

ms

______

ALERT and

______

THERM/ADDR pins

VOL

Output low voltage

ISINK = 8 mA

0.4

V