LIS344ALH

Package information

17/19

6

Package information

packages. These packages have a lead-free second level interconnect. The category of

second level Interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

.

Figure 21.

LGA 16L: mechanical data and package dimensions

Dimensions

Ref.

mm

inch

Min. Typ. Max. Min.

Typ.

Max.

A1

1.500

1.600

0.05910.0630

A2

1.330

0.0524

A3

0.160

0.200

0.240 0.0063 0.0079 0.0094

d0.300

0.0118

D1

3.850

4.000

4.150 0.1516 0.1575 0.1634

E1

3.850

4.000

4.150 0.1516 0.1575 0.1634

L2

1.950

0.0768

M

0.100

0.0039

N1

0.650

0.0256

N2

0.975

0.0384

P1

1.750

0.0689

P2

1.525

0.0600

T1

0.400

0.0157

T2

0.300

0.0118

k

0.050

0.0020

LGA 16L (4x4x1.5mm)

Land Grid Array Package

Outline and

7974136

mechanical data