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V1.0

23/10/19

Lead Free Solder Wire

Newark.com/exclusive-brands

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Characteristics

Standard

Appearance

Bright and shiny surface finishes

Alloy

Sn/ Cu 0.7

JIS-Z-3282

Melting Point

227°C to 228°C

DSC

Flux Content

3 ±1%

JIS-Z-3283

Halide Content

Under 0.5%

JIS-Z-3197

Gravity

7.3

Spread Ability

>75%

JIS-Z-3197

Diameters (Tolerances)

0.3mm to 0.6mm ±0.05mm,

0.8mm to 3mm ±0.1mm

JIS-Z-3283

Storage, Handling and Shelf Life

Storage must be in a dry, non-corrosive and shine environment. Avoids the oxidant, the

acid and the hydrogen peroxide. Shelf life is 2 years from date of manufacture.

Specifications

Physical Properties & Reliability Data

• Excellent solder joint reliability.

• Superior joint strength.

• Excellent thermal & Mechanical fatigue resistance.

• Low cleaning required after solder joint.

Features

No

Test Item

Test Result

Test Method

1

Copper Mirror Test

PASS

IPC-TM-650, 2.3.32

2

Copper Plate Corrosion

PASS

JIS-Z-3197, 6.6.1

3

S.I.R Test

PASS 1x1010 up

IPC-TM-650, 2.6.3.3

4

Electro Migration Test

PASS 1x1010 up

IPC-TM-650, 2.6.14.1