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Comchip Technology CO., LTD.

REV:A

QW-JTR28

Company reserves the right to improve product design , functions and reliability without notice.

- Ultra small SMD plastic package

Features

0.016(0.40)

Dimensions in inches and (millimeter)

WBFBP-03E/SOT-883

0.041(1.05)

0.037(0.95)

0.026(0.65)

0.022(0.55)

0.004(0.10)

0.000(0.01)

0.022(0.55)

0.018(0.45)

0.025(0.635)

REF.

0.012(0.30)

0.008(0.20)

0.004(0.10)

0.002(0.05)

REF.

0.012(0.30)

0.008(0.20)

0.018(0.45)

REF.

0.015(0.37)

0.011(0.27)

0.002(0.05)

REF.

0.018(0.45)

REF.

0.015(0.37)

0.011(0.27)

Mechanical data

- Mounting position: Any.

- Case: WBFBP-03E/SOT-883 molded plastic

encapsulate diodes.

TK3906LED03-HF (PNP)

RoHS Device

General Purpose Transistor

Halogen Free

Symbol

Parameter

Unit

Value

-40

-5

V

mA

Maximum Ratings (at TA=25°C unless otherwise noted)

-200

-40

V

Collector-Base voltage

Collector-Emitter voltage

Emitter-Base voltage

Collector current

VCEO

VCBO

VEBO

IC

V

Circuit Diagram

3N

C

E

B

- 1. BASE

- 2. EMITTER

- 3. COLLECTOR

100

-55~150

mW

150

°C

Junction temperature

Collector power dissipation

Storage temperature rage

PC

TJ

Tstg

°C

1250

°C/W

Thermal resistance from junction to ambient

RΘJA

1

Base

2

Emitter

Collector

3

Marking: 3N

- Epitaxial planar die construction

- Available in lead free version

Top View

3

2

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