POWER DISSIPATION

DFN(PL)1010-4

PD-DFN(PL)1010-4-(85125150)-JE-B

i

The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.

The following measurement conditions are based on JEDEC STD. 51.

Measurement Conditions

Item

Measurement Conditions

Environment

Mounting on Board (Wind Velocity = 0 m/s)

Board Material

Glass Cloth Epoxy Plastic (Four-Layer Board)

Board Dimensions

76.2 mm × 114.3 mm × 0.8 mm

Copper Ratio

Outer Layer (First Layer): Less than 95% of 50 mm Square

Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square

Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square

Through-holes



0.2 mm × 21 pcs

Measurement Result

(Ta = 25°C, Tjmax = 125°C)

Item

Measurement Result

Power Dissipation

800 mW

Thermal Resistance (ja)



ja = 125°C/W

Thermal Characterization Parameter (ψjt)

ψjt = 58°C/W



ja: Junction-to-Ambient Thermal Resistance

ψjt: Junction-to-Top Thermal Characterization Parameter

Power Dissipation vs. Ambient Temperature

Measurement Board Pattern

The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.

Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of

use and the total years of use must be limited as follows:

0

200

400

600

800

1000

1200

0

25

50

75

100

125

150

Ambient Temperature (°C)

85

1000

800

Total Hours of Use

Total Years of Use (4 hours/day)

13,000 hours

9 years