R8152x

NO. EC-238-180730

10

PACKAGE INFORMATION

POWER DISSIPATION (HSOP-6J)

The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.

The following conditions are used in this measurement.

Measurement Conditions

Ultra-high Wattage Land Pattern

Standard Land Pattern

Environment

Mounting on Board

(Wind Velocity = 0 m/s)

Mounting on Board

(Wind Velocity = 0 m/s)

Board Material

Glass Cloth Epoxy Plastic

(Four-layer Board)

Glass Cloth Epoxy Plastic

(Double-sided Board)

Board Dimensions

76.2 mm × 114.3 mm × 0.8 mm

50 mm × 50 mm × 1.6 mm

Copper Ratio

96%

50%

Through-holes

 0.3 mm × 28 pcs

 0.5 mm × 24 pcs

Measurement Result

(Ta = 25°C, Tjmax = 150°C)

Ultra-high Wattage Land Pattern Standard Land Pattern

Free Air

Power Dissipation

3400 mW

2100 mW

675 mW

Thermal Resistance

37°C/W

59°C/W

185°C/W

Ultra-high Wattage

Standard

IC Mount Area (mm)

Power Dissipation vs. Ambient Temperature

Measurement Board Pattern

0

250

500

750

1000

1250

1500

1750

2000

2250

2500

2750

3000

3250

3500

0

25

50

75

100

125

150

Ambient Temperature (

°C)

3400

2100

On Board

Ultra-high Wattage

Land Pattern

On Board

Standard Land Pattern

675

Free Air

50

76.2

50

20