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AP200N06NF bảng dữ liệu(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP200N06NF bảng dữ liệu(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP200N06NF 65V N-Channel Enhancement Mode MOSFET AP200N06NF REV1.0 永源微電子科技有限公司 Electrical Characteristics (TJ=25℃, unless otherwise noted) Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-Source Breakdown Voltage VGS = 0V, ID = 250µA 65 72 - V lGSS Gate-body Leakage current VDS = 0V, VGS = ±20V - - ±100 nA IDSS Zero Gate Voltage Drain Current TJ=25°C VDS = 60V, VGS = 0V - - 1 μA Zero Gate Voltage Drain Current TJ=100°C - - 100 VGS(th) Gate-Threshold Voltage VDS = VGS, ID = 250µA 2 2.9 4 V RDS(on) Drain-Source on-Resistance4 VGS = 10V, ID = 20A - 1.6 2.0 mΩ gfs Forward Transconductance4 VDS=10V, ID=20A - 62 - S Ciss Input Capacitance VDS = 30V, VGS =0V, f =1MHz - 5990 - pF Coss Output Capacitance - 2257 - Crss Reverse Transfer Capacitance - 86 - Rg Gate Resistance f =1MHz - 2.6 - Ω Qg Total Gate Charge VGS = 10V, VDS = 30V, ID=20A - 102 - nC Qgs Gate-Source Charge - 24.6 - Qgd Gate-Drain Charge - 28.2 - td(on) Turn-on Delay Time VGS =10V, VDD =30V, RG = 3Ω, ID= 20A - 15.6 - ns tr Rise Time - 29 - td(off) Turn-off Delay Time - 63 - tf Fall Time - 51 - trr Body Diode Reverse Recovery Time IF = 20A, dI/dt=100A/µs - 80 - ns Qrr Body Diode Reverse Recovery Charge - 114 - nC VSD Diode Forward Voltage4 IS = 20A, VGS = 0V - - 1.2 V IS Continuous Source Current TC=25°C - - 378 A Note : 1、The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width .The EAS data shows Max. rating . 3、The power dissipation is limited by 175 ℃ junction temperature 4、EAS condition: TJ=25 ℃, VDD=48V, VG=10V, RG=25Ω, L=0.1mH, IAS= 55A 5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. . |
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