Outline Dimensions

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Vishay Semiconductors

Revision: 08-Jul-15

1

Document Number: 95046

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D2PAK

DIMENSIONS in millimeters and inches

Notes

(1) Dimensioning and tolerancing per ASME Y14.5 M-1994

(2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at

the outmost extremes of the plastic body

(3) Thermal pad contour optional within dimension E, L1, D1 and E1

(4) Dimension b1 and c1 apply to base metal only

(5) Datum A and B to be determined at datum plane H

(6) Controlling dimension: inch

(7) Outline conforms to JEDEC® outline TO-263AB

SYMBOL

MILLIMETERS

INCHES

NOTES

SYMBOL

MILLIMETERS

INCHES

NOTES

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

A

4.06

4.83

0.160

0.190

D1

6.86

8.00

0.270

0.315

3

A1

0.00

0.254

0.000

0.010

E

9.65

10.67

0.380

0.420

2, 3

b

0.51

0.99

0.020

0.039

E1

7.90

8.80

0.311

0.346

3

b1

0.51

0.89

0.020

0.035

4

e

2.54 BSC

0.100 BSC

b2

1.14

1.78

0.045

0.070

H

14.61

15.88

0.575

0.625

b3

1.14

1.73

0.045

0.068

4

L

1.78

2.79

0.070

0.110

c

0.38

0.74

0.015

0.029

L1

-

1.65

-

0.066

3

c1

0.38

0.58

0.015

0.023

4

L2

1.27

1.78

0.050

0.070

c2

1.14

1.65

0.045

0.065

L3

0.25 BSC

0.010 BSC

D

8.51

9.65

0.335

0.380

2

L4

4.78

5.28

0.188

0.208

c

B

Detail A

c2

A

A

A

± 0.004

B

M

A

Lead tip

(3)

(3)

View A - A

(E)

(D1)

E1

B

H

A1

Detail “A”

Rotated 90 °CW

Scale: 8:1

L

Gauge

plane

0° to 8°

L3

L4

Seating

plane

Section B - B and C - C

Scale: None

(4)

(4)

(b, b2)

b1, b3

(c)

c1

Base

Metal

Plating

Conforms to JEDEC

® outline D2PAK (SMD-220)

13

2

D

C

A

L2

E

(2)(3)

(2)

4

H

BB

2 x b

2 x b2

L1

0.010

A

B

M

M

(3)

e

2 x

Pad layout

MIN.

11.00

(0.43)

MIN.

9.65

(0.38)

MIN.

3.81

(0.15)

MIN.

2.32

(0.08)

17.90 (0.70)

15.00 (0.625)

2.64 (0.103)

2.41 (0.096)