Technical Data Sheet

3474AN/R3DB-AFGC/XR/MS

Everlight Electronics Co., Ltd.

http\\:www.everlight.com

Rev 1

Page: 9 of 10

Device Number : DT1-347-020

Prepared date: 03-10-20088

Prepared by: Grace Shen

Prehead

laminar wave

Fluxing

Recommended soldering profile

Avoiding applying any stress to the lead frame while the LEDs are at high temperature

particularly when soldering.

Dip and hand soldering should not be done more than one time

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or

vibration until the LEDs return to room temperature.

A rapid-rate process is not recommended for cooling the LEDs down from the peak

temperature.

Although the recommended soldering conditions are specified in the above table, dip or

handsoldering at the lowest possible temperature is desirable for the LEDs.

Wave soldering parameter must be set and maintain according to recommended

temperature and dwell time in the solder wave.

4. Cleaning

When necessary, cleaning should occur only with isopropyl alcohol at room temperature

for a duration of no more than one minute. Dry at room temperature before use.

Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of

ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the

assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not

cause damage to the LED