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AP150P03NF bảng dữ liệu(PDF) 2 Page - A POWER MICROELECTRONICS

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AP150P03NF
-30V P-Channel Enhancement Mode MOSFET
AP150P03NF RVE1.0
永源微電子科技有限公司
Electrical Characteristics (TJ=25
℃, unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
BVDSS
Drain-Source Breakdown Voltage
VGS=0V ID=-250μA
-30
-35
V
IDSS
Zero Gate Voltage Drain Current
VDS=-30V, VGS=0V
-1
μA
IGSS
Gate-Body Leakage Current
VGS=±20V, VDS=0V
±100
nA
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=-250μA
-1
-1.7
-2.5
V
RDS(ON)
Drain-Source On-State Resistance
VGS=-10V, ID=-20A
2.5
3.2
mΩ
VGS=-4.5V, ID=-20A
4.0
5.2
mΩ
gFS
Forward Transconductance
VDS=-5V, ID=-20A
65
S
Ciss
Input Capacitance
VDS=-15V, VGS=0V, f=1.0MHz
7000
pF
Coss
Output Capacitance
820
pF
Crss
Reverse Transfer Capacitance
540
pF
Rg
Gate resistance
VGS=0V, VDS=0V, f=1.0MHz
2.2
Ω
td(on)
Turn-on Delay Time
VGS=-10V, VDS=-15V,
RL=0.75Ω, RGEN=3Ω
14
nS
tr
Turn-on Rise Time
13
nS
td(off)
Turn-Off Delay Time
65
nS
tf
Turn-Off Fall Time
37
nS
Qg
Total Gate Charge
VGS=-10V, VDS=-15V, ID=-20A
130
nC
Qgs
Gate-Source Charge
12
nC
Qgd
Gate-Drain Charge
31
nC
ISD
Source-Drain Current (Body Diode)
-150
A
VSD
Forward on Voltage (Note 3)
VGS=0V, IS=-20A
-1.3
V
trr
Reverse Recovery Time
IF=-20A, di/dt=100A/μs
30
ns
Qrr
Reverse Recovery Charge
IF=-20A, di/dt=100A/μs
40
nC
Note :
1
、The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper.
2
、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3
、 The EAS data shows Max. rating . The test condition is TJ =25℃, VDD=-15V, VG=-10V, RG=25Ω, L=0.5mH, IAS=-30A
4
、The power dissipation is limited by 150℃ junction temperature
5
、The data is theoretically the same as I D and I DM , in real applications , should be limited by total power dissipation.



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