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AP150N04P bảng dữ liệu(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP150N04P bảng dữ liệu(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 8 page ![]() AP150N04PIT 40V N-Channel Enhancement Mode MOSFET AP150N04P/T RVE1.0 永源微電子科技有限公司 Electrical Characteristics (TJ=25℃, unless otherwise noted) Symbol Parameter Conditions Min Typ Max Unit BVDSS Drain-Source Breakdown Voltage VGS=0V ID=250μA 40 44 V IDSS Zero Gate Voltage Drain Current VDS=40V, VGS=0V 1 μA IGSS Gate-Body Leakage Current VGS=±20V, VDS=0V ±100 nA VGS(th) Gate Threshold Voltage VDS=VGS, ID=250μA 1.0 1.8 2.5 V gFS Forward Transconductance VDS=5V, ID=20A 38 S RDS(ON) Drain-Source On-State Resistance VGS=10V, ID=20A 2.4 2.9 mΩ VGS=4.5V, ID=20A 3.5 4.5 mΩ Ciss Input Capacitance VDS=20V,VGS=0V, f=1.0MHz 6460 pF Coss Output Capacitance 455 pF Crss Reverse Transfer Capacitance 276 pF Rg Gate resistance VGS=0V, VDS=0V, f=1.0MHz 0.67 Ω td(on) Turn-on Delay Time VGS=10V, VDS=20V, RL=1Ω, RGEN=3Ω 18 nS tr Turn-on Rise Time 4.4 nS td(off) Turn-Off Delay Time 67 nS tf Turn-Off Fall Time 9.5 nS Qg Total Gate Charge VGS=10V, VDS=20V, ID=20A 112 nC Qgs Gate-Source Charge 16.7 nC Qgd Gate-Drain Charge 26.5 nC ISD Source-Drain Current (Body Diode) 144 A VSD Forward on Voltage (Note 3) VGS=0V, IS=20A 1.2 V trr Reverse Recovery Time IF=20A, dI/dt=500A/ s 6 ns Qrr Reverse Recovery Charge IF=20A, dI/dt=500A/ s 14 nC Note : 1 、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2 、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3 、The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=20A 4 、The power dissipation is limited by 150℃ junction temperature 5 、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. |
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