STM32F101X6 datasheet(85/87 Pages) STMICROELECTRONICS

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STM32F101x4, STM32F101x6

Revision history

Table 51. Document revision history

Date

Revision

Changes

23-Sep-2008

Initial release.

07-Apr-2009

I/O information clarified on page 1. Figure 7: Memory map modified.

In Table 4: Low-density STM32F101xx pin definitions: PB4, PB13, PB14,

PB15, PB3/TRACESWO moved from Default column to Remap column.

VREF- is not available in the offered packages: Figure 1: STM32F101xx

Low-density access line block diagram, Figure 10: Power supply scheme

and Figure 34: Power supply and reference decoupling updated,

Figure 30: Power supply and reference decoupling (VREF+ not

connected to VDDA) removed.

Note modified in Table 12: Maximum current consumption in Run mode,

code with data processing running from Flash and Table 14: Maximum

current consumption in Sleep mode, code running from Flash or RAM.

Figure 15, Figure 16 and Figure 17 show typical curves.

ACCHSI max values modified in Table 23: HSI oscillator characteristics.

Small text changes.

24-Sep-2009

Note 5 updated and Note 4 added in Table 4: Low-density STM32F101xx

pin definitions.

VRERINT and TCoeff added to Table 11: Embedded internal reference

voltage. Typical IDD_VBATvalue added in Table 15: Typical and maximum

current consumptions in Stop and Standby modes. Figure 14: Typical

current consumption on VBAT with RTC on versus temperature at

different VBAT values added.

fHSE_ext min modified in Table 19: High-speed external user clock

characteristics.

CL1 and CL2 replaced by C in Table 21: HSE 4-16 MHz oscillator

characteristics and Table 22: LSE oscillator characteristics (fLSE =

32.768 kHz), notes modified and moved below the tables.

Note 1 modified below Figure 20: Typical application with an 8 MHz

crystal.

Table 23: HSI oscillator characteristics modified. Conditions removed from

Table 25: Low-power mode wakeup timings.

Figure 27: Recommended NRST pin protection modified.

IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to

IEC 61967-2 in Section 5.3.10: EMC characteristics on page 49.

Jitter added to Table 26: PLL characteristics.

CADC and RAIN parameters modified in Table 41: ADC characteristics.

RAIN max values modified in Table 42: RAIN max for fADC = 14 MHz.

Small text changes.

20-May-2010

Added VFQFPN48 package.

Updated note 2 below Table 38: I2C characteristics

Updated Figure 28: I2C bus AC waveforms and measurement circuit(1)

Updated Figure 27: Recommended NRST pin protection

Updated Section 5.3.12: I/O current injection characteristics

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