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Evaluation Module

Bill Of Materials

THS9001

SLOS426B – NOVEMBER 2003 – REVISED JANUARY 2007

APPLICATION INFORMATION (continued)

Table 1 is the bill of materials, and Figure 26 and Figure 27 show the EVM layout.

ITEM

DESCRIPTION

REF DES

QTY

1

Cap, 0.1 µF, ceramic, X7R, 50 V

C1

1

(AVX) 08055C104KAT2A

2

Cap, 1000 pF, ceramic, NPO, 100 V

C2, C3

2

(AVX) 08051A102JAT2A

3

Inductor, 470 nH, 5%

L1

1

(Coilcraft) 0805CS-471XJBC

4

Resistor, 237

Ω, 1/8 W, 1%

R1

1

(Phycomp) 9C08052A2370FKHFT

5

Open

TR1

1

6

Jack, banana receptance, 0.25" dia.

J3, J4

2

(SPC) 813

7

Connector, edge, SMA PCB jack

J1, J2

2

(Johnson) 142-0701-801

8

Standoff, 4-40 Hex, 0.625" Length

4

(KEYSTONE) 1808

9

Screw, Phillips, 4-40, .250"

4

SHR-0440-016-SN

10

IC, THS9001

U1

1

(TI) THS9001DBV

11

Board, printed-circuit

1

(TI) EDGE # 6453522 Rev.A

(1)

The manufacturer's part numbers are used for test purposes only.

Figure 26. EVM Top Layout

Figure 27. EVM Bottom Layout

14

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