APM32E103CET6 datasheet(39/79 Pages) GEEHY

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consult the corresponding manufacturer.

Table 19 HSECLK4~16MHz Oscillator Characteristics

Symbol

Parameter

Conditions

Minimum

value

Typical

value

Maximum

value

Unit

fOSC_IN

Oscillator

frequency

MHz

Feedback

resistance

200

kΩ

IDD(HSECLK)

HSECLK current

consumption

VDD=3.3V,

CL=10pF@8MHz

0.56

tSU(HSECLK)

Startup time

VDD is stable

0.85

Note: It is obtained from a comprehensive evaluation and is not tested in production.

5.5.1.2.

Low-speed external clock generated by crystal resonator

For detailed parameters (frequency, package, precision, etc.) of crystal resonator, please

consult the corresponding manufacturer.

Table 20 LSECLK Oscillator Characteristics (fLSECLK=32.768KHz)

Symbol

Parameter

Conditions

Minimum

value

Typical

value

Maximum

value

Unit

fOSF_IN

Oscillator

frequency

32.768

KHz

IDD(LSECLK)

LSECLK current

consumption

0.8

μA

tSU(LSECLK)(1)

Startup time

VDDIOx is stable

0.93

Note: It is obtained from a comprehensive evaluation and is not tested in production.

（1）

tSU(LSECLK) is the startup time, which is measured from the time when LSECLK is enabled by software to the time

when stable oscillation at 32.768KHz is obtained. This value is measured using a standard crystal resonator, which

may vary greatly due to different crystal manufacturers.

5.5.2.

Characteristics of internal clock source

High speed internal (HSICLK) RC oscillator

Table 21 HSICLK Oscillator Characteristics

Symbol

Parameter

Conditions

Minimum

value

Typical

value

Maximum

value

Unit

fHSICLK

Frequency

MHz

ACCHSICLK

Accuracy of HSICLK

oscillator

Factory

calibration

VDD=3.3V，

TA=25

℃(1)

-1

VDD=2-3.6V，

TA=-40~105

℃

-1.5

1.5

IDDA(HSICLK)

Power consumption of

HSICLK oscillator

μA

tSU(HSICLK)

Startup time of HSICLK

oscillator

VDD=3.3V，TA=-40~105

℃

3.24

3.4

μs

Note: It is obtained from a comprehensive evaluation and is not tested in production.

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