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AP20G04GD bảng dữ liệu(PDF) 3 Page - A POWER MICROELECTRONICS |
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AP20G04GD bảng dữ liệu(HTML) 3 Page - A POWER MICROELECTRONICS |
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3 / 10 page ![]() AP20G04GD 40V N+P-Channel Enhancement Mode MOSFET AP20G04GD REV1.1 永源微電子科技有限公司 P-Channel Electrical Characteristics (TJ=25 ℃, unless otherwise noted) Symbol Parameter Test Condition Min. Typ. Max. Units V(BR)DSS Drain-Source Breakdown Voltage VGS=0V, ID= -250μA -40 - - V IDSS Zero Gate Voltage Drain Current VDS= -40V, VGS=0V - - -1 μA IGSS Gate to Body Leakage Current VDS=0V, VGS=±20V - - ±100 nA VGS(th) Gate Threshold Voltage VDS=VGS, ID= -250μA -1.0 -1.6 -2.5 V RDS(on) Static Drain-Source on-Resistance VGS= -10V, ID= -6A - 32 39 mΩ VGS= -4.5V, ID= -5A - 40 48 Ciss Input Capacitance VDS= -20V, VGS=0V, f=1.0MHz - 1244 - pF Coss Output Capacitance - 97 - pF Crss Reverse Transfer Capacitance - 80 - pF Qg Total Gate Charge VDS= -20V, ID= -5A, VGS= -10V - 23 - nC Qgs Gate-Source Charge - 4 - nC Qgd Gate-Drain(“Miller”) Charge - 4 - nC td(on) Turn-on Delay Time VDD= -20V, ID= -5A, VGS= -10V, RGEN=2.5Ω - 5 - ns tr Turn-on Rise Time - 2 - ns td(off) Turn-off Delay Time - 51 - ns tf Turn-off Fall Time - 29 - ns IS Maximum Continuous Drain to Source Diode Forward Current - - -21 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - -60 A trr Reverse Recovery Time TJ=25℃, IF=10A,dI/dt=100A/μs - 13 - ns Qrr Reverse Recovery Charge - 7 - nC VSD Drain to Source Diode Forward Voltage VGS=0V, IS= -10A - -0.8 -1.2 V Note : 1、The data tested by surface mo unted on a 1 inch2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3、The EAS data shows Max. rating . The test condition is VDD=-25V,VGS=-10V,L=0.1mH,I AS=-10A 4、The power dissipation is limited by 150℃ junction temperature 5 、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. |
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