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DBVPACKAGE

(TOP VIEW)

5

1

V

CC

OE

2

A

3

4

GND

Y

DCKPACKAGE

(TOP VIEW)

2

A

3

4

GND

V

CC

5

OE

Y

1

YZP PACKAGE

(BOTTOMVIEW)

2

A

V

CC

1 5

OE

GND

4

3

Y

DESCRIPTION/ORDERING INFORMATION

SN74LVC1G240

SINGLE BUFFER/DRIVER

WITH 3-STATE OUTPUT

SCES305J – JANUARY 2001 – REVISED JANUARY 2007

• Available in the Texas Instruments

• I

NanoFree™ Package

Operation

• Supports 5-V V

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• Inputs Accept Voltages to 5.5 V

• ESD Protection Exceeds JESD 22

• Max t

–

2000-V Human-Body Model (A114-A)

• Low Power Consumption, 10-µA Max I

CC

–

200-V Machine Model (A115-A)

• ±24-mA Output Drive at 3.3 V

–

1000-V Charged-Device Model (C101)

The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable

(OE) input is high.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74LVC1G240YZPR

_ _ _CK_

0.23-mm Large Bump – YZP (Pb-free)

Reel of 3000

SN74LVC1G240DBVR

SOT (SOT-23) – DBV

C40_

–40

°C to 85°C

Reel of 250

SN74LVC1G240DBVT

Reel of 3000

SN74LVC1G240DCKR

SOT (SC-70) – DCK

CK_

Reel of 250

SN74LVC1G240DCKT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.