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AP3N80D bảng dữ liệu(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP3N80D bảng dữ liệu(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 8 page ![]() AP3N80DIY 800V N-Channel Enhancement Mode MOSFET AP3N80D/Y REV1.0 永源微電子科技有限公司 Electrical Characteristics (TJ=25℃, unless otherwise noted) Parameter Symbol Test Conditions Min. Typ. Max. Units BVDSS Drain-source Breakdown Voltage VGS=0V, ID=250UA 800 870 V VGS(TH) Gate Threshold Voltage VGS=VDS, ID=250uA 3.0 4.0 5.0 V IDSS Drain-source Leakage Current VDS=800V, VGS=0V, Tj=25 ℃ 1 uA VDS=640V, VGS=0V, Tj=125 ℃ 10 uA gfs Forward Transconductance VDS=15V, ID=2.0A 2.5 S IGSS Gate-body Leakage Current VGS =±30V ±100 nA RDS(ON) Static Drain-source On Resistance VGS=10V, ID=2.0A 4.8 5.5 Ω Ciss Input Capacitance VGS=0V, VDS=25V F=1.0MHZ 530 pF Coss Output Capacitance 57 pF Crss Reverse transfer Capacitance 7.0 pF Td(on) Turn-on Delay Time VDD=400V, ID =3.0A RG=25Ω 15 ns Tr Rise Time 40 ns Td(off) Turn -Off Delay Time 30 ns Tf Fall Time 30 ns Qg Total Gate Charge ID=3.0A, VDS=640V VGS=10V 15 nC Qgs Gate-to-Source Charge 3.5 nC Qgd Gate-to-Drain Charge 7.7 nC IS Continuous Diode Forward Current 3.0 A VSD Diode Forward Voltage Tj=25°C, Is=3.0A VGS =0V 1.4 V trr Reverse Recovery Time Tj=25°C, If=3.0A di/dt=100A/μs 530 ns Qrr Reverse Recovery Charge 2.8 uC Note : 1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2 、The EAS data shows Max. rating . IAS = 4.5A, VDD = 50V, RG = 25 Ω, Starting TJ = 25 ºC 3 、The test condition is Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 1% 4 、The power dissipation is limited by 150℃ junction temperature 5 、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. |
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