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TLE4963-2M bảng dữ liệu(PDF) 66 Page - Infineon Technologies AG

tên linh kiện TLE4963-2M
Giải thích chi tiết về linh kiện  Sensor solutions for automotive, industrial and consumer applications
PDF  91 Pages
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nhà sản xuất  INFINEON [Infineon Technologies AG]
Trang chủ  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

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MEMS microphones for consumer
Low self-noise (SNR), wide dynamic range, low distortions, high acoustic overload point
www.infineon.com/mems
The popularity of voice user interfaces and the usage of audio recording to share information and experiences are
increasing dramatically. However, the performance of microphones often limits the potential of today’s cutting-edge
devices. Not anymore!
Infineon XENSIV™ MEMS microphones introduce a new performance class for MEMS microphones that overcomes existing
audio chain limitations. IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low
distortions, and a high acoustic overload point are required. Infineon’s latest analog XENSIV™ MEMS microphone IM73A135
pushes the level of audio performance even further (Highlights).
Our new IM73A135 sets a new performance benchmark in MEMS microphones
Infineon’s latest MEMS microphone IM73A135 sets a new performance benchmark
in MEMS microphones. Best-in-class signal to noise ratio (SNR) of 73 dB and a high
acoustic overload point of 135 dB SPL enables crystal clear audio pick up. This
high dynamic range microphone with a small footprint of 4 x 3 x 1.2 mm3 is based
on Infineon’s new Sealed Dual Membrane MEMS technology, which allows for
better handling during assembly. The IM73A135 allows designers to reach a level of
high audio performance that was previously only achievable by ECMs while at the
same time reaping the benefits inherent in MEMS technology.
Features
› 69 dB(A) signal-to-noise ratio (SNR)
› Below 1 percent distortions at 128 dBSPL (130 dBSPL AOP)
› Digital (PDM) interface with 6 µs group delay at 1 kHz
› Tight sensitivity (-36 ±1 dB) and phase (± 2 deg) tolerances
› 28 Hz low frequency roll-off
› 4.0 x 3.0 x 1.2 mm³ package
Benefits
› High fidelity and far-field audio recording
› Matched, noise and distortion-free audio signals for ad-
vanced audio processing
› Ultralow group delay for latency-critical applications
› No analog components required
Typical applications
› High-quality audio capturing: e.g. cameras, camcorders, conference systems
› Voice user interface: e.g. smart speaker, home automation, and IoT devices
› Active noise cancellation: headphones and earphones
› Audio pattern detection: predictive maintenance, security or safety applications
Product portfolio
Product
OPN
Package
Current consumption
Sensitivity
Signal to noise
[dB]
Supply voltage
[V]
IM69D130
IM69D130V01XTSA1
LLGA-5-1
980 µA
-36 dBFS
69
1.62–3.6
IM69D120
IM69D120V01XTSA1
LLGA-5-1
980 µA
-26 dBFS
69
1.62–3.6
NEW IM73A135
IM73A135V01XTSA1
PG-LLGA-5-2
170 µA @ 2.75 V, 70 µA @ 1.6 V
-38 dBV
73
1.52–3.0
MEMS microphones



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