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M40SZ100Y bảng dữ liệu(PDF) 19 Page - STMicroelectronics |
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M40SZ100Y bảng dữ liệu(HTML) 19 Page - STMicroelectronics |
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19 / 25 page ![]() M40SZ100Y, M40SZ100W Package mechanical data 19/25 5 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 12. SO16 – 16-lead plastic small package outline Note: Drawing is not to scale. Table 8. SO16 – 16-lead plastic small plastic package mechanical data SO-b E N CP B e A2 D C L A1 α H A 1 Symbol mm inches Typ. Min. Max. Typ. Min. Max. A1.75 0.069 A1 0.10 0.25 0.004 0.010 A2 1.60 0.063 B 0.35 0.46 0.014 0.018 C 0.19 0.25 0.007 0.010 D 9.80 10.00 0.386 0.394 E 3.80 4.00 0.150 0.158 e 1.27 – – 0.050 – – H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 a 0°8° 0°8° N16 16 CP 0.10 0.004 |
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