Issue 1 - September 2005

1

www.zetex.com

© Zetex Semiconductors plc 2005

Package information - DIL8

Dual in-line, 8 pin package

Package outline

Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters

Taping specification

Dual inline devices (DIL8, DIL14, DIL16 and DIL20) are provided in tubes.

DIM

Inches

Millimeters

DIM

Inches

Millimeters

Min

Max

Min

Max

Min

Max

Min

Max

A

-

0.210

-

5.33

D1

0.005

-

0.13

-

A1

0.015

-

0.38

-

E

0.300

0.325

7.62

8.26

A2

0.115

0.195

2.92

4.95

E1

0.240

0.280

6.10

7.11

b

0.014

0.022

0.36

0.56

e

0.100 BSC

2.54 BSC

b2

0.045

0.070

1.14

1.78

eA

0.300 BSC

7.62 BSC

b3

0.030

0.045

0.76

1.14

eB

-

0.430

-

10.92

c

0.008

0.014

0.20

0.36

eC

0.000

0.060

0.00

1.52

D

0.355

0.400

9.02

10.16

L

0.115

0.150

2.92

3.81

E1

D

A2

A

L

A1

e

b

b2

E

b3

D1

b2

eA

eB

c

eC