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GP50B60PD bảng dữ liệu(PDF) 1 Page - International Rectifier

tên linh kiện GP50B60PD
Giải thích chi tiết về linh kiện  SMPS IGBT
PDF  10 Pages
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nhà sản xuất  IRF [International Rectifier]
Trang chủ  http://www.irf.com
Logo IRF - International Rectifier

GP50B60PD bảng dữ liệu(HTML) 1 Page - International Rectifier

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WARP2 SERIES IGBT WITH
ULTRAFAST SOFT RECOVERY DIODE
IRGP50B60PD
1
www.irf.com
07/02/07
Features
• NPT Technology, Positive Temperature Coefficient
• Lower VCE(SAT)
• Lower Parasitic Capacitances
• Minimal Tail Current
• HEXFRED Ultra Fast Soft-Recovery Co-Pack Diode
• Tighter Distribution of Parameters
• Higher Reliability
Benefits
• Parallel Operation for Higher Current Applications
• Lower Conduction Losses and Switching Losses
• Higher Switching Frequency up to 150kHz
E
G
n-channel
C
VCES = 600V
VCE(on) typ. = 2.00V
@ VGE = 15V IC = 33A
Equivalent MOSFET
Parameters
RCE(on) typ. = 61mΩ
ID (FET equivalent) = 50A
Applications
• Telecom and Server SMPS
• PFC and ZVS SMPS Circuits
• Uninterruptable Power Supplies
• Consumer Electronics Power Supplies
TO-247AC
G
C
E
SMPS IGBT
PD - 94624B
Absolute Maximum Ratings
Parameter
Max.
Units
VCES
Collector-to-Emitter Voltage
600
V
IC @ TC = 25°C
Continuous Collector Current
75
IC @ TC = 100°C
Continuous Collector Current
42
ICM
Pulse Collector Current (Ref. Fig. C.T.4)
150
ILM
Clamped Inductive Load Current
d
150
A
IF @ TC = 25°C
Diode Continous Forward Current
50
IF @ TC = 100°C
Diode Continous Forward Current
25
IFRM
Maximum Repetitive Forward Current
e
100
VGE
Gate-to-Emitter Voltage
±20
V
PD @ TC = 25°C
Maximum Power Dissipation
370
W
PD @ TC = 100°C
Maximum Power Dissipation
150
TJ
Operating Junction and
-55 to +150
TSTG
Storage Temperature Range
°C
Soldering Temperature for 10 sec.
300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw
10 lbf·in (1.1 N·m)
Thermal Resistance
Parameter
Min.
Typ.
Max.
Units
RθJC (IGBT)
Thermal Resistance Junction-to-Case-(each IGBT)
–––
–––
0.34
°C/W
RθJC (Diode)
Thermal Resistance Junction-to-Case-(each Diode)
–––
–––
0.64
RθCS
Thermal Resistance, Case-to-Sink (flat, greased surface)
–––
0.24
–––
RθJA
Thermal Resistance, Junction-to-Ambient (typical socket mount)
–––
–––
40
Weight
–––
6.0 (0.21)
–––
g (oz)


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