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STF4NK50ZD bảng dữ liệu(PDF) 5 Page - STMicroelectronics

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Electrical characteristics
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Table 7.
Source drain diode
Symbol
Parameter
Test condictions
Min
Typ.
Max
Unit
ISD
Source-drain current
3
A
ISDM
(1)
1.
Pulse width limited by safe operating area
Source-drain current (pulsed)
12
A
VSD
(2)
2.
Pulsed: pulse duration=300µs, duty cycle 1.5%
Forward on voltage
ISD = 3A, VGS=0
1.6
V
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 3A,
di/dt = 100A/µs,
VDD = 34V, Tj = 25°C
73
140
3.82
ns
nC
A
trr
Qrr
IRRM
Reverse recovery time
Reverse Recovery Charge
Reverse recovery current
ISD = 3A,
di/dt = 100A/µs,
VDD = 34V, Tj = 150°C
118
260
4.4
ns
nC
A
Table 8.
Gate-source zener diode
Symbol
Parameter
Test condictions
Min.
Typ.
Max
Unit
BVGSO
(1)
1.
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
Gate-source braekdown
voltage
IGS = ±1mA (open drain)
30
V



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