STPS30L60C

Package information

9/11

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 8.

TO-247 dimensions

REF.

DIMENSIONS

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

4.85

5.15

0.191

0.203

D

2.20

2.60

0.086

0.102

E

0.40

0.80

0.015

0.031

F

1.00

1.40

0.039

0.055

F1

3.00

0.118

F2

2.00

0.078

F3

2.00

2.40

0.078

0.094

F4

3.00

3.40

0.118

0.133

G

10.90

0.429

H

15.45

15.75 0.608

0.620

L

19.85

20.15 0.781

0.793

L1

3.70

4.30

0.145

0.169

L2

18.50

0.728

L3

14.20

14.80 0.559

0.582

L4

34.60

1.362

L5

5.50

0.216

M

2.00

3.00

0.078

0.118

V

5°

5°

V2

60°

60°

Dia.

3.55

3.65

0.139

0.143

H

L2

L5

L

L4

D

E

M

L1

L3

F2

F3

F4

F1

V2

F(x3)

G

A

V

V

Dia