SSM3582ACPZ-R7 datasheet(58/58 Pages) AD

58 / 58 page

SSM3582A

Data Sheet

Rev. A | Page 58 of 58

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.30

0.25

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

0.20 MIN

4.70

4.60 SQ

4.50

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5

END VIEW

EXPOSED

PAD

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

SEATING

PLANE

PIN 1

INDICATOR

AREA

Figure 88. 40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.75 mm Package Height

(CP-40-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

Temperature Range

Package Description

Package Option

SSM3582ACPZ

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-7

SSM3582ACPZ-RL

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-7

SSM3582ACPZ-R7

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-7

EVAL-SSM3582Z

Evaluation Board

Z = RoHS Compliant Part.

The SSM3582A uses the EVAL-SSM3582Z evaluation board.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D21861-8/20(A)

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