SSM2537

Data Sheet

Rev. 0 | Page 16 of 16

OUTLINE DIMENSIONS

Figure 34. 9-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-9-5)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

SSM2537ACBZ-R7

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-5

SSM2537ACBZ-RL

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-5

EVAL-SSM2537Z

Evaluation Board

1 Z = RoHS Compliant Part.

A

B

C

0.560

0.500

0.440

1.240

1.200 SQ

1.160

1

2

3

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

END VIEW

0.300

0.260

0.220

0.80

REF

0.80

REF

0.40

REF

SEATING

PLANE

0.230

0.200

0.170

COPLANARITY

0.05

BALL A1

IDENTIFIER

©2012 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D10981-0-10/12(0)