7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage

range

IN to GND

-0.3

5.5

V

OUT to GND

-5.5

0.3

V

CFLY- to GND

0.3

VO - 0.3

V

CFLY+ to GND

-0.3 V

VI + 0.3

V

Continuous power dissipation

See Section 9.2.1.2.5

Continuous output current

80

mA

Maximum junction temperature, TJ

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

-55°C

150°C

°C

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

pins(1)

-1000

1000

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

-500

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Input voltage range, VI

1.8

5.25

V

Output current range at OUT, IO

60

mA

Input capacitor, CI

0

C(fly)

µF

Flying capacitor, C(fly)

1

µF

Output capacitor, CO

1

100

µF

Operating junction temperature, TJ

-40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

TPS6040x

UNIT

DBV

5 PINS

RθJA

Junction-to-ambient thermal resistance

221.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

81.9

RθJB

Junction-to-board thermal resistance

39.8

ψJT

Junction-to-top characterization parameter

3.3

ψJB

Junction-to-board characterization parameter

38.9

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

TPS60400, TPS60401, TPS60402, TPS60403

SLVS324C – JULY 2001 – REVISED OCTOBER 2020

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