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C9531
Document #: 38-07034 Rev. *E
Page 9 of 10
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Drawing and Dimension
All product and company names mentioned in this document may be the trademarks of their respective holders.
28-lead (5.3 mm) Shrunk Small Outline Package O28
51-85079-*C
PIN 1 ID
SEATING
PLANE
BSC.
BSC
0°-8°
PLANE
GAUGE
1
28
9.60[0.378]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
6.50[0.256]
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
9.80[0.386]
0.15[0.006]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
0.25[0.010]
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
DIMENSIONS IN MM[INCHES] MIN.
MAX.
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.16 gms
PART #
Z28.173 STANDARD PKG.
ZZ28.173 LEAD FREE PKG.
28-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z28.173
51-85120-*A
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