USX2064 datasheet(40/54 Pages) MICROCHIP

tên linh kiện	USX2064

Giải thích chi tiết về linh kiện	USB 2.0 Hi-Speed 4-Port Hub Controller with Battery Charging

PDF	54 Pages

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nhà sản xuất	MICROCHIP [Microchip Technology]

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40 / 54 page

USX2064

DS00001986E-page 40



2023 Microchip Technology Inc and its subsidiaries.

6.2.1

PACKAGE THERMAL SPECIFICATIONS

Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multi-

layer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are

based on the package body, die size, maximum power consumption, 85°C ambient temperature, and 125°C junction

temperature of the die.

Use the following formulas to calculate the junction temperature:

TJ = P x JA + TA

TJ = P x JT + TT

TJ = P x JC + TC

TABLE 6-3:

PACKAGE THERMAL RESISTANCE PARAMETERS

Symbol

USX2064

(°C/W)

Velocity (Meters/s)

JA

40.1

35.0

JT

0.5

0.7

JC

6.3

TABLE 6-4:

LEGEND

Symbol

Description

Junction temperature

Power dissipated

JA

Junction-to-ambient-temperature

JC

Junction-to-top-of-package

JT

Junction-to-bottom-of-case

Ambient temperature

Temperature of the bottom of the case

Temperature of the top of the case

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