PCAN

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Vishay Dale Thin Film

Revision: 23-Oct-2019

3

Document Number: 60125

For technical questions, contact: thinfilm@vishay.com

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Note

• Chip surface temperature measured using FLIR SC645 thermal

imaging

system

with

an

approximate

testcard

surface

temperature of 75 °C

Note

• Chip surface temperature measured using FLIR SC645 thermal

imaging

system

with

an

approximate

testcard

surface

temperature of 75 °C

Note

• Chip surface temperature measured using FLIR SC645 thermal

imaging system with an approximate test card surface

temperature of 85 °C

•Thermal imaging was conducted under ambient conditions

resulting in a steady state test card surface temperature of 85 °C

over the full range of power levels

• Thermal imaging and load life testing was conducted mounting

one device to a 1.6" x 3.7" test card with 3.5 mil copper plating

on both surfaces. Thermal vias on 50 mil centers were utilized for

heat transfer between surfaces of the test card

Note

• Chip surface temperature measured using FLIR SC645 thermal

imaging system with an approximate test card surface

temperature of 85 °C

STANDARD MATERIAL SPECIFICATIONS

Resistive element

Passivated nichrome

Substrate material

Aluminum nitride

Terminations (tin/lead)

Tin / lead solder over nickel barrier

Terminations (lead (Pb)-free)

Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over nickel barrier

PCAN0603 CHIP TEMP VS. APPLIED POWER

70

150

200

Chip Surface Temperature Temperature (°C)

200

Ω

20

Ω

7.0

6.0

4.0

3.0

2.0

1.0

0.0

5.0

PCAN0805 CHIP TEMP VS. APPLIED POWER

70

150

200

Chip Surface Temperature Temperature (°C)

200

Ω

50

Ω

8.0

6.0

4.0

3.0

2.0

1.0

0.0

5.0

7.0

PCAN1206 CHIP TEMP VS. APPLIED POWER

70

150

200

Chip Surface Temperature Temperature (°C)

12.0

10.0

8.0

6.0

4.0

2.0

0.0

175

Ω

30

Ω

PCAN2512 CHIP TEMP VS. APPLIED POWER

70

150

200

Chip Surface Temperature Temperature (°C)

12.0

10.0

8.0

6.0

4.0

2.0

0.0

150

Ω

30

Ω