MIC24054

DS20007043B-page 10

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2025-2026 Microchip Technology Inc. and its subsidiaries

FIGURE 2-24:

Die Temperature* (VIN = 5V)

vs. Output Current.

FIGURE 2-25:

Die Temperature* (VIN =

12V) vs. Output Current.

FIGURE 2-26:

IC Power Dissipation

(VIN = 5V) vs. Output Current.

FIGURE 2-27:

IC Power Dissipation

(VIN = 12V) vs. Output Current.

FIGURE 2-28:

Efficiency (VIN = 5V) vs.

Output Current.

FIGURE 2-29:

Efficiency (VIN = 12V) vs.

Output Current.

*Die Temperature: The temperature measurement was taken at the hottest point on the MIC24054 case mounted on

a 5 square inch, 4 layer PCB, tested in ambient temperature of 23°C to 25°C in open space with no forced cooling; see

the Thermal Measurements section. Actual results will depend upon the size of the PCB, ambient temperature, and

proximity to other heat-emitting components.

0

20

40

60

01.534.567.59

OUTPUT

URRENT (A)

V

OUT = 1.8V

0

20

40

60

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OUTPUT

RRENT (A

V

OUT = 1.8V

0

0.5

1

1.5

2

2.5

3

3.5

01.53

4.567.59

OUTPUT CURRENT(A)

Vout=0.8V

Vout=3.3V

V

OUT = 0.8V

V

OUT =3.3V

0

0.5

1

1.5

2

2.5

3

3.5

01.534.567.59

OUTPUT CURRENT (A)

Vout=5V

Vout=0.8V

V

OUT = 0.8V

V

OUT =5V

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02468

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OUTPUT CURRENT (A)

0.8V

0.9V

1V

1.2V

1.5V

1.8V

2.5V

3.3V

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55

60

65

70

75

80

85

90

95

100

02468

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OUTPUT CURRENT (A)

0.8V

0.9V

1V

1.2V

1.5V

1.8V

2.5V

3.3V

5V