L6226PD datasheet(13/22 Pages) STMICROELECTRONICS

13 / 22 page

13/22

L6226

APPLICATION INFORMATION

A typical application using L6226 is shown in Fig. 12. Typical component values for the application are shown

in Table 2. A high quality ceramic capacitor in the range of 100 to 200 nF should be placed between the power

pins (VSA and VSB) and ground near the L6226 to improve the high frequency filtering on the power supply and

reduce high frequency transients generated by the switching. The capacitors connected from the ENA/OCDA

and ENB/OCDB nodes to ground set the shut down time for the Brgidge A and Bridge B respectively when an

over current is detected (see Overcurrent Protection). The two current sources (SENSEA and SENSEB) should

be connected to Power Ground with a trace length as short as possible in the layout. To increase noise immu-

nity, unused logic pins are best connected to 5V (High Logic Level) or GND (Low Logic Level) (see pin descrip-

tion). It is recommended to keep Power Ground and Signal Ground separated on PCB.

Table 2. Component Values for Typical Application

Figure 12. Typical Application

100uF

1N4148

100nF

1N4148

CBOOT

220nF

RCLA

Ω

10nF

RCLB

Ω

CENA

5.6nF

RENA

100k

Ω

CENB

5.6nF

RENB

100k

Ω

CREF

68nF

100

Ω

CBOOT

OUT1A

LOADA

LOADB

OCDA

OCDB

OUT2A

GND

PROGCLA

OUT2B

OUT1B

VSA

POWER

GROUND

SIGNAL

GROUND

8-52VDC

VSB

VCP

VBOOT

SENSEA

IN1A

IN2A

IN1A

IN2A

ENA

ENB

CENB

RENB

RENA

ENA

ENB

IN2B

IN1B

IN2B

IN1B

SENSEB

RCLA

CENA

PROGCLB

RCLB

D02IN1344

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