ADCS9888 datasheet(10/34 Pages) NSC

10 / 34 page

DC and Logic Electrical Characteristics (Continued)

The following specifications apply for GND=0V,V

D =VDD =PVD = +3.3 VDC, ADC Clock = 205 MHz, unless otherwise speci-

fied. Boldface limits apply for T

A =TMIN to TMAX; all other limits TA = 25˚C.

Symbol

Parameter

Conditions

Min

(Note 9)

Typical

(Note 8)

Max

(Note 9)

Units

I/O Supply Current

25˚C - 140 MSPS

25˚C - 170 MSPS

25˚C - 205 MSPS

PLL Supply Current

25˚C - 140 MSPS

25˚C - 170 MSPS

25˚C - 205 MSPS

Total Power Dissipation

Full Temp. – 140 MSPS

320

365

Full Temp. – 170 MSPS

330

375

Full Temp. – 205 MSPS

390

420

Power Down Supply Current

Full Temp.

8.4

Power Down Dissipation

Full Temp.

Analog Channel Characteristics

The following specifications apply for GND=0V,V

D =VDD =PVD = +3.3 VDC,VDD = +3.3 VDC, ADC Clock = 205 MHz, un-

less otherwise specified. Boldface limits apply for T

A =TMIN to TMAX; all other limits TA = 25˚C (Note 7).

Symbol

Parameter

Conditions

Min

(Note 9)

Typical

(Note 8)

Max

(Note 9)

Units

Analog Bandwidth, Full Power

25˚C

500

MHz

Transient Response

25˚C

Overvoltage Recovery Time

25˚C

1.5

SNR

Signal to Noise Ratio

(Without Harmonics)

25˚C – 140 MSPS

40.7

25˚C –170 MSPS

40.7

43.5

25˚C –205 MSPS

40.5

43.5

SNR

Signal to Noise Ratio

(Without Harmonics)

Full temp. – 140 MSPS

Full Temp. – 170 MSPS

43.5

Full Temp. – 205 MSPS

43.5

Crosstalk

Full Temp.

dBc

THERMAL CHARACTERISTICS

Junction to Case Thermal

Resistance

12.3

˚C/W

Junction to Ambient Thermal

Resistance

30.2

˚C/W

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

Note 2: All voltages are measured with respect to GND=0V, unless otherwise specified.

Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA or VD), the current at that pin should be limited to 25 mA.

The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25

mA to two.

Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature, TA. The maximum

allowable power dissipation at any temperature is PD =(TJMAX –TA)/θJA.TJMAX = 150˚C for this device. The typical thermal resistance (θJA) of this part when board

mounted is TBD ˚C/W for the VLA128A 128 pin PQFP package.

Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 200 pF discharged through a 0 Ω resistor.

Note 6: Soldering process must comply with National Semiconductor’s reflow temperature profile specifications. Refer to "www.national.com/packaging".

Note 7: Two diodes clamp the OS analog inputs to AGND and VA as shown below. This input protection, in combination with the external clamp capacitor and the

output impedance of the video source, prevents damage to the ADCS9888 from transients during power-up.

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