OP467GSZ datasheet(6/20 Pages) AD

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OP467

Rev. F | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter1

Rating

Supply Voltage2

±18 V

Input Voltage3

±18 V

Differential Input Voltage3

±26 V

Output Short-Circuit Duration

Limited

Storage Temperature Range

14-Lead CERDIP and 20-Terminal LCC

−65°C to +175°C

14-Lead PDIP and 16-Lead SOIC

−65°C to +150°C

Operating Temperature Range

OP467A

−55°C to +125°C

OP467G

−40°C to +85°C

Junction Temperature Range

14-Lead CERDIP and 20-Terminal LCC

−65°C to +175°C

14-Lead PDIP and 16-Lead SOIC

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

1 Absolute maximum ratings apply to both DICE and packaged parts, unless

otherwise noted.

2 For proper operation, the positive supply must be sequenced ON before the

negative supply.

3 For supply voltages less than ±18 V, the absolute maximum input voltage is

equal to the supply voltage.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 5.

Package Type

θJA1

θJC

Unit

14-Lead CERDIP (Y)

°C/W

14-Lead PDIP (P)

°C/W

16-Lead SOIC (S)

°C/W

20-Terminal LCC (RC)

°C/W

1 θJA is specified for the worst-case conditions, that is, θJA is specified for device

in socket for CERDIP, PDIP, and LCC packages, and θJA is specified for device

soldered in circuit board for the SOIC package.

DICE CHARACTERISTICS

10 +IN C

–IN C

+IN D

–IN D

–IN A

+IN A

+IN B

–IN B

V+

V–

Figure 5. 0.111 Inch × 0.100 Inch DIE Size, 11,100 sq. mils,

Substrate Connected to V+, 165 Transistors

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