Copyright © 2014-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and

the UR logo are registered trademarks of UL LLC.

8

XLamp® XB-H LED

rEFLow soLDErinG CHArACtEristiCs

In testing, Cree has found XLamp XB‑H LEDs to be compatible with JEDEC J‑STD‑020C, using the parameters listed below. As a general

guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used,

and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

Profile Feature

Lead-Free solder

Average Ramp‑Up Rate (Ts

max to Tp)

1.2 °C/second

Preheat: Temperature Min (Ts

min)

120 °C

Preheat: Temperature Max (Ts

max)

170 °C

Preheat: Time (ts

min to tsmax)

65-150 seconds

Time Maintained Above: Temperature (T

L)

217 °C

Time Maintained Above: Time (t

L)

45‑90 seconds

Peak/Classification Temperature (Tp)

235 ‑ 245 °C

Time Within 5 °C of Actual Peak Temperature (tp)

20‑40 seconds

Ramp‑Down Rate

1 ‑ 6 °C/second

Time 25 °C to Peak Temperature

4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

IPC/JEDEC J‑STD‑020C

T

P

T

L

Time

t 25˚C to Peak

Preheat

ts

t

S

t

P

25

Ramp-down

Ramp-up

Critical Zone

T

L to TP

Ts

max

Ts

min